Special Contents for Automotive Applications
The reason RICOH power management IC has been chosen for more than 20 years
Special Contents for IoT Devices
Ultra-low supply current / Low noise / Low electromotive force / Battery monitoring
Special Contents for Industrial Applications
Long term supply / Flexible quantity purchase / High quality and reliability
IC packages become smaller and smaller as electronic devices do. At the same time, the packages are required to feature high heat dissipation, reliability, and density.
Ricoh provides three types of packages: lead package, leadless package, and WL-CSP package. Lead package includes gull-wing package and flat-lead package excellent in self-alignment property. Leadless package includes Wettable Flank package that is suitable for automotive, and Multi Chip Module package useful to reduce the number of components and to enhance electrical characteristics. WL-CSP package is one of the smallest packages in the world, contributing to smaller and lighter mobile devices, IoT products, etc.
Ricoh offers a rich package lineup meeting various needs of customers.
Ricoh introduces the necessary information for WLCSP implementation including recommended conditions, reflow profile, and precautions for mounting WLCSP product on printed board.