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Ricoh Packages

Ricoh offers a rich package lineup meeting various needs of customers.

Ricoh Packages

*Lead Package

Full lineup including small packages and high heat dissipation packages

Lead package comes in a variety of forms such as a gull-wing type and a flat lead type, depending on a lead shape.

Having leads enables to easily check a status of solder joining when mounting on board. Lead package is high in mounting reliability due to its resistance against stress such as a temperature change, high to low, and its mounting strength capable of withstanding intense vibration.

Ricoh offers a number of small and high heat dissipation packages to support compact and large-current electronic devices in recent years.

Leadless Package

*Leadless Package

The lineup of ultra-small leadless package capable of reducing mounting area

Due to the miniaturization of applications, adopting small, thin and mount-area-reducible leadless packages such as DFN and PLP packages are increasing.

Ricoh offers a number of ultra-small and thin leadless packages meeting various needs of customers.

Lineup of ultra-small and thin leadless packages

Leadless Package

*WLCSP (Wafer Level Chip Size Package)

Package that achieves world's smallest class size

The advantage of WLCSP (Wafer Level Chip Size Package) is small, thin, and light weight. The size of semiconductor chip equals to the size of package.

Adopting WLCSP contributes to the miniaturization and the weight reduction for mobile devices and IoT devices.

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