For Automotive Applications
For Industrial Applications
For IoT Devices
Thermal resistance values of the main packages are suggested below.
|Packages||θja (°C/W)||ψjt (°C/W)|
Thermal resistance is mentioned in PDFs of Package List.
The definitions are as follows:
θja: Thermal Resistance between Tj and Ta
ψjt: Thermal Resistance between Tj and Tt
θjc: Thermal Resistance between Tj and the Bottom Surface of the Package
Junction temperature refers to the temperature of a chip inside a package. Temperatures around a package are called as follows:
Ta: Ambient Temperature
Tt: Temperature of the Top Surface
Tj: Junction Temperature
Maximum junction temperature refers to the allowable maximum temperature during operation of a chip. Temperature momentarily exceeding the allowable value may cause permanent damage and may degrade reliability and safety of both the device and the system containing it. Operation at or over the rated temperature is not assured. See the item "Tj" in Absolute Maximum Ratings on datasheets to obtain information about operating temperature of each product.
In some package outlines, geometrical dimensioning and tolerancing is used to indicate shape tolerance, in addition to size tolerance. Geometrical tolerancing is defined by ISO, JIS, ASME, etc. For example, JIS defines it from JISB0021. Squares only containing values represent theoretically-accurate measurements.
The characters represent product codes (output voltage, detector threshold, etc.) and lot numbers. See the part markings in product specifications for more details.
The tab (thermal pad) is at the ground level. The tab is better to be connected to the GND in order to ensure heat dissipation and mounting strength, but leaving it open is also acceptable.
The packing outlines are below:
ONE VOLUME PACKING
FIVE VOLUME PACKING
Packing materials are as follows:
Feed direction is contained in the product name, like -E2, -TR, -TL, and -T1. The directions of each are suggested below:
The following information is included in the product label.
ex. Barcode labels (code 39) with a QR code
Explanation about Lot No.
|Mark Lot No.||A lot number marked on the product|
|Manufacturing Lot No.||The lot number at assembly process|
|Wafer Lot No.||The lot number at wafer process|
Data Included in the QR code
The QR code includes the following data:
"Product Name", "Number of the Product", "QC LOT (Manufacturing Lot No.)", "Wafer Lot No."
We have complied with RoHS Directive by introducing lead (Pb) free since April 1st, 2006.
Also, we have shipped out halogen-free products only, since April 1st, 2012.
See the following page for more information about Ricoh Environment Policy.
You can obtain the information from the page below.
Product reliability is indicated by Mean Time Between Failure (MTBF) for repairable, Mean Time To Failure (MTTF) for unrepairable, and Failures in Time (FITs). MTTF is applied for semiconductor devices because they are unrepairable.
MTTF and failure rates of Ricoh electronic products are suggested in the PDF below.
FIT is calculated by the following formula:
1FIT = 10-9 (Failure/Time) = 10-4 (%/1000h)
The data is obtained from test results with 110 samples and zero defects.
This is calculated as follows:
FIT value = (number of defects) / (number of tests × test time × acceleration factor)
As the number of tests increases, the FIT value decreases.
In Ricoh electronic devices, data is calculated with 110 pieces, due to the cost and man-hours required for the test.